Benchtop Reflow Oven

● Independent Air Velocity Controlling by section can achieve flexibleprocessing adjustment, therefore dealing with various & complicated Lead Free Processing easily;
● New Cooling Configuration to make the filteredor reclaimed air back to oven chamber, it reduced the thermal loss as well as get better flux reclamation;
● Longer maintenanceperiod for oven chamber;
●New Air Management System withsignificant energy save, lower electric power consumption & lower carbon;
● The chambers with multi-layers and thicker thermalinsulation to attain the lower temp. of oven surface.
● 95 % Materials of Reflow Oven can be recycled.

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The benchtop reflow oven is a compact benchtop soldering system designed for prototyping, low-volume SMT production, and R&D applications. It provides precise temperature control and programmable reflow profiles to melt solder paste and firmly attach components to PCBs. Unlike industrial-grade reflow ovens, benchtop reflow ovens have smaller chambers, faster heating times, and a user-friendly interface, making them ideal for labs and workshops. Some advanced models support convection heating, nitrogen-assisted heating, and real-time temperature monitoring. This type of reflow oven is widely used by engineers, hobbyists, and educators for PCB assembly, repair, and low-volume production.

MODEL RS-600III/RS-600III-N
GENERAL
Outside Dimension(L*W*H) 4190 x 1430 x 1530mm
Weight Approx. 1850KG/1950KG
Number Of Heating Zones Up 6 / Bottom 6
Length Of Heating Zones 2295mm
Number Of Cooling Zones Up 1 / Bottom 1  (Cool Air Conversion)
Exhaust Volume 10 m³ / min x 2 (Exhausts)
Control System
Electric Supply Required 3 phase, 380V 50/60Hz    (Optional: 3 phase, 400V/480V 50/60Hz )
Electric Power Required 48KW / 51KW
Power For Warm Up 24KW / 26KW
Power Consumption 6.5KW / 7KW
Warming Time Approx. 20 minute
Temp. Setting Range Room Temp. —  300℃
Temperature Control Method PID Close Loop Control + SSR Driving
Temperature Control Precision ± 1.0℃
Temperature Deviation on PCB ± 1.5℃  (by JT Board Test Standard)
Commutated Element Aluminium Alloy Plate
Data Storage Various prameters and status are storable (80GB)
Abnormal Alarm Abnormal Temperature (Extra-high / Extra-low Temp.)
Board Dropped Alarm Tower Light: Yellow–Warming; Green-Normal; Red-Abnormal
Conveyor System
Rail Structure Subsection Integrated Type     (Option : Subsection Separate Control)
Max.Width Of PCB 400mm (OPTION :460mm)
Range Of Rail Width/Adjustment 50~400mm / Motorized
Components Clearance PCB Top 30mm/ Bottom 25mm
Converyor Direction  L→R      (Option: R→L)
Fixed Rail Side Front Rail Fixed (Option:Rear Rail Fixed)
PCB Transmission Agent Air-Reflow =Chain + Mesh ,
( N2-Reflow = Chain only and Mesh optional)
Converyor Height 900±20mm
Converyor Speed Range 300~2000mm/min
Lubrication Auto-Afflux Standard
Cooling System
Cooling Method  Standard:Forced-Air Type

Notes: D:Dual rails,Fixed mode is optional,the max width of PCB is 250*250mm;N:Nitrogen;L:the max width of PCB is 610mm
The above contents are subiect to change without further notice.

FEATURED PRODUCTS

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