A surface mount oven, or SMT reflow oven, is a critical device in electronics manufacturing. It uses precisely controlled heating zones to solder surface-mounted components onto PCBs. The process begins in the preheat zone, where the PCB and solder paste are gradually warmed to avoid thermal shock. Next, the reflow zone raises temperatures to melt the solder paste, enabling components to bond securely with PCB pads. Advanced models feature forced hot air convection systems and PID temperature control for uniform heating and ±1°C accuracy. In the final cooling zone, forced air solidifies the solder, forming robust connections. Modern ovens often include nitrogen environments to reduce oxidation and improve solder quality. With modular designs and energy-efficient heating elements, these ovens ensure high production efficiency and reliable solder joints for diverse applications, from prototyping to high-volume manufacturing.
| MODEL | RS-600III/RS-600III-N |
| GENERAL | |
| Outside Dimension(L*W*H) | 4190 x 1430 x 1530mm |
| Weight | Approx. 1850KG/1950KG |
| Number Of Heating Zones | Up 6 / Bottom 6 |
| Length Of Heating Zones | 2295mm |
| Number Of Cooling Zones | Up 1 / Bottom 1 (Cool Air Conversion) |
| Exhaust Volume | 10 m³ / min x 2 (Exhausts) |
| Control System | |
| Electric Supply Required | 3 phase, 380V 50/60Hz (Optional: 3 phase, 400V/480V 50/60Hz ) |
| Electric Power Required | 48KW / 51KW |
| Power For Warm Up | 24KW / 26KW |
| Power Consumption | 6.5KW / 7KW |
| Warming Time | Approx. 20 minute |
| Temp. Setting Range | Room Temp. — 300℃ |
| Temperature Control Method | PID Close Loop Control + SSR Driving |
| Temperature Control Precision | ± 1.0℃ |
| Temperature Deviation on PCB | ± 1.5℃ (by JT Board Test Standard) |
| Commutated Element | Aluminium Alloy Plate |
| Data Storage | Various prameters and status are storable (80GB) |
| Abnormal Alarm | Abnormal Temperature (Extra-high / Extra-low Temp.) |
| Board Dropped Alarm | Tower Light: Yellow–Warming; Green-Normal; Red-Abnormal |
| Conveyor System | |
| Rail Structure | Subsection Integrated Type (Option ： Subsection Separate Control) |
| Max.Width Of PCB | 400mm (OPTION ：460mm) |
| Range Of Rail Width/Adjustment | 50~400mm / Motorized |
| Components Clearance | PCB Top 30mm/ Bottom 25mm |
| Converyor Direction | L→R (Option: R→L) |
| Fixed Rail Side | Front Rail Fixed (Option:Rear Rail Fixed) |
| PCB Transmission Agent | Air-Reflow =Chain + Mesh , ( N2-Reflow = Chain only and Mesh optional) |
| Converyor Height | 900±20mm |
| Converyor Speed Range | 300～2000mm/min |
| Lubrication Auto-Afflux | Standard |
| Cooling System | |
| Cooling Method | Standard：Forced-Air Type |
Notes: D：Dual rails，Fixed mode is optional,the max width of PCB is 250*250mm；N：Nitrogen；L：the max width of PCB is 610mm
The above contents are subiect to change without further notice.
