3D Solder Paste Inspection SPI
- ● 3D solder paste inspection based on white-lightsine stripe PMP technology;
- ● Solder paste height inspection accuracy reaches 1 um;
- ● Auto-restore pad 3D data on PCB surface, calculate thevolume, area, height and deviation of every solder
- ● Multi-direction,multi-angle 3D PMP inspection;
- ● Vivid and easy to used graphic interaction interface, comprehensive function and easy to handle;
- ● In addition to programming with Gerber file, image-oriented edit mode can also realize off-lineprogramming and debugging;
- ● Multi-touch function can realize 3D image rotationand 2D image resizing, convenient to check and confirm solder paste condition;
- ● Comprehensives SPC function includes manykind of diagrams generation and output;
- ● Image accelerate calculations base on multi-GPU;
- ● Integrated cast iron frame structure, highrigidity can avoid outside vibration
