A 3D solder paste inspection (SPI) system is a precision optical measurement tool that ensures accurate solder paste deposition in SMT assembly lines. Using advanced 3D imaging technologies like structured light or laser triangulation, it captures high-resolution (5-10μm) volumetric data of each solder paste deposit, measuring critical parameters including:
• Paste height (Z-axis) with ±1μm repeatability
• Volume accuracy within ±3%
• XY positional alignment
• Shape/profile consistency
The system compares measurements against CAD designs to detect defects like insufficient paste, bridging, or misalignment before reflow. Modern 3D SPI systems feature:
AI-powered defect classification (IPC-A-610 standards)
Real-time statistical process control (SPC)
Closed-loop feedback to stencil printers
100% inspection at 20-50 panels/hour
Essential for HDI boards and fine-pitch components (<0.3mm pitch), this technology reduces soldering defects by up to 90% while providing full traceability for automotive/medical applications.
| Model | REFINE-XS |
| Inspection Module | |
| Camera Specification | 5M High-frequency Industrial Camera, High Frame Number (Factory Setting); 12M Option |
| Pixel | 20μm, 15μmꢀ(Factory Setting) |
| FOV(single field of view) Range | 40×40 mm, 30×30 mm (Factory Setting) |
| LED | RGB + TOP |
| Light Source | 0 – 550 μm |
| Height Inspection Resolution | 0.36 μm |
| Height Inspection Accuracy | 1μm (Based on the actual solder paste/calibration block) |
| Inspection Item | Volume, Area, Height, X/Y Position, Bridging, Shape, etc |
| Defective Type | Excessive/Insufficient/Missing paste,Bridge,2D & 3D Paste displacement, Shape deformity, Dust, etc |
| Repeatability (Volume, Area, Height) | <1% @3sigma |
| GR & R (Gauge Reproducebility and Repeatability) | < 10% (@6sigma tolerance = +/- 50%) |
| Inspection Speed | 0.35Sec / FOV |
| Conveyor & PCB Size | |
| Max PCB Size | 460×410 mm |
| Min PCB Size | 50×50 mm |
| PCB Up-Clearance | 30 mm |
| PCB Bottom-Clearance | 30 mm |
| PCB Thickness | 0.5-5 mm |
| Max PCB Warpage | ±3 mm |
| PCB Transfer Height | 2.5mm |
| PCB Transfer Height | 900±20 mm |
| Max PCB Weight | 5KG |
| Frame & Others | |
| Base & Frame | Integra1 steel casmting frame; firmly, ensure high accuracy of inspection |
| Dimensions and Weight | 947x1321x1600mm (W x D x H) 950KG |
| Power Supply | AC 220V 1Φ 50/60Hz |
| Power | 2.2KW |
| Communication Interface | SMEMA |
| Air Supply | 4-6bar，5L/min |
| Operating Condition | 5-40℃, 15-90% RH |
| Options | |
| 1. BarcodeReader | 4. Repair Station (PC) |
| 2. 3D Calibration Target | 5. Infared Muti-touch LCD + Voice Control |
| 3. 2D Calibration Glass | 6. Offline Editing Software (License Key) |
| The above contents are subject to change without further notice! | |
