The circuit board reflow process precisely melts solder paste to permanently attach SMD components to PCBs. It follows a controlled thermal profile with four phases: preheating (gradual ramp-up to 150°C), soaking (flux activation at 150-180°C), reflow (peak temperature 220-250°C for lead-free alloys), and cooling (controlled solidification). Modern systems use convection heating with nitrogen inerting to ensure uniform heat distribution and prevent oxidation. This automated process achieves reliable electrical connections while accommodating components ranging from tiny 01005 chips to large BGAs. Critical for mass production, it maintains IPC Class 3 standards for aerospace, medical, and automotive electronics.
| MODEL | RS-600III/RS-600III-N |
| GENERAL | |
| Outside Dimension(L*W*H) | 4190 x 1430 x 1530mm |
| Weight | Approx. 1850KG/1950KG |
| Number Of Heating Zones | Up 6 / Bottom 6 |
| Length Of Heating Zones | 2295mm |
| Number Of Cooling Zones | Up 1 / Bottom 1 (Cool Air Conversion) |
| Exhaust Volume | 10 m³ / min x 2 (Exhausts) |
| Control System | |
| Electric Supply Required | 3 phase, 380V 50/60Hz (Optional: 3 phase, 400V/480V 50/60Hz ) |
| Electric Power Required | 48KW / 51KW |
| Power For Warm Up | 24KW / 26KW |
| Power Consumption | 6.5KW / 7KW |
| Warming Time | Approx. 20 minute |
| Temp. Setting Range | Room Temp. — 300℃ |
| Temperature Control Method | PID Close Loop Control + SSR Driving |
| Temperature Control Precision | ± 1.0℃ |
| Temperature Deviation on PCB | ± 1.5℃ (by JT Board Test Standard) |
| Commutated Element | Aluminium Alloy Plate |
| Data Storage | Various prameters and status are storable (80GB) |
| Abnormal Alarm | Abnormal Temperature (Extra-high / Extra-low Temp.) |
| Board Dropped Alarm | Tower Light: Yellow–Warming; Green-Normal; Red-Abnormal |
| Conveyor System | |
| Rail Structure | Subsection Integrated Type (Option ： Subsection Separate Control) |
| Max.Width Of PCB | 400mm (OPTION ：460mm) |
| Range Of Rail Width/Adjustment | 50~400mm / Motorized |
| Components Clearance | PCB Top 30mm/ Bottom 25mm |
| Converyor Direction | L→R (Option: R→L) |
| Fixed Rail Side | Front Rail Fixed (Option:Rear Rail Fixed) |
| PCB Transmission Agent | Air-Reflow =Chain + Mesh , ( N2-Reflow = Chain only and Mesh optional) |
| Converyor Height | 900±20mm |
| Converyor Speed Range | 300～2000mm/min |
| Lubrication Auto-Afflux | Standard |
| Cooling System | |
| Cooling Method | Standard：Forced-Air Type |
Notes: D：Dual rails，Fixed mode is optional,the max width of PCB is 250*250mm；N：Nitrogen；L：the max width of PCB is 610mm
The above contents are subiect to change without further notice.
