Convection reflow soldering utilizes forced hot air circulation to achieve precise, uniform heating for surface mount assembly. This technology employs multiple independently controlled heating zones with turbulent airflow to maintain temperature uniformity within ±1.5°C across the PCB. The directed hot air penetrates between components, ensuring complete solder paste reflow without cold spots or component shadowing effects. Modern systems feature advanced thermal profiling capabilities, automatically adjusting airflow velocity (0.5-2.0 m/s) and temperature (up to 300°C) for different solder alloys. Optional nitrogen environments (O₂ < 1000ppm) further enhance wetting performance. Compared to infrared methods, convection reflow provides superior process control for mixed-technology boards containing both miniature 01005 chips and large thermal mass components.
| MODEL | RS-600III/RS-600III-N |
| GENERAL | |
| Outside Dimension(L*W*H) | 4190 x 1430 x 1530mm |
| Weight | Approx. 1850KG/1950KG |
| Number Of Heating Zones | Up 6 / Bottom 6 |
| Length Of Heating Zones | 2295mm |
| Number Of Cooling Zones | Up 1 / Bottom 1 (Cool Air Conversion) |
| Exhaust Volume | 10 m³ / min x 2 (Exhausts) |
| Control System | |
| Electric Supply Required | 3 phase, 380V 50/60Hz (Optional: 3 phase, 400V/480V 50/60Hz ) |
| Electric Power Required | 48KW / 51KW |
| Power For Warm Up | 24KW / 26KW |
| Power Consumption | 6.5KW / 7KW |
| Warming Time | Approx. 20 minute |
| Temp. Setting Range | Room Temp. — 300℃ |
| Temperature Control Method | PID Close Loop Control + SSR Driving |
| Temperature Control Precision | ± 1.0℃ |
| Temperature Deviation on PCB | ± 1.5℃ (by JT Board Test Standard) |
| Commutated Element | Aluminium Alloy Plate |
| Data Storage | Various prameters and status are storable (80GB) |
| Abnormal Alarm | Abnormal Temperature (Extra-high / Extra-low Temp.) |
| Board Dropped Alarm | Tower Light: Yellow–Warming; Green-Normal; Red-Abnormal |
| Conveyor System | |
| Rail Structure | Subsection Integrated Type (Option ： Subsection Separate Control) |
| Max.Width Of PCB | 400mm (OPTION ：460mm) |
| Range Of Rail Width/Adjustment | 50~400mm / Motorized |
| Components Clearance | PCB Top 30mm/ Bottom 25mm |
| Converyor Direction | L→R (Option: R→L) |
| Fixed Rail Side | Front Rail Fixed (Option:Rear Rail Fixed) |
| PCB Transmission Agent | Air-Reflow =Chain + Mesh , ( N2-Reflow = Chain only and Mesh optional) |
| Converyor Height | 900±20mm |
| Converyor Speed Range | 300～2000mm/min |
| Lubrication Auto-Afflux | Standard |
| Cooling System | |
| Cooling Method | Standard：Forced-Air Type |
Notes: D：Dual rails，Fixed mode is optional,the max width of PCB is 250*250mm；N：Nitrogen；L：the max width of PCB is 610mm
The above contents are subiect to change without further notice.
