Mini- Selective Wave Soldering System

● The soldering for double-side PCB can be applied automatically
● Offline programming function/ Gerber file can be applicable
● Without any initial PCB data, the figure can be loaded quickly with simple & fast graphic programming; Selective flux spraying can control the flux processing accurately as well as keeping the clear surface of PCB with extremely low flux consumption
● The temperature controls for top and bottom preheating is independent. Infrared heating can improve heating efficiency and keep temperature uniformity
● Transmission speed of wave nozzle is adjustable. Online rail-time wave height monitoring and auto calibration function
● Adopted CCD camera to monitor solder processing, the soldering quality can betraced in whole processing

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Parameters Smartcell-400
Dimension(L×W×H) 1650×1800×1650mm
Transporting System
PCB Width 60-400 mm
PCB Length 120-400 mm
PCB Top Side Clearance Max.120 mm
PCB Bottom Side Clearance Min.50 mm
PCB Edge Clearance 4 mm
Conveyor Height 900±20
Conveying speed 0.2-10M/min
Pallet/PCB weight Max:5kg
Flux Module
Flux Capacity 2L
The Size of Flux Nozzle Tube 130um(Double Nozzle is option)
Flux Width 2-8mm
Preheat Module
Bottom Dynamic Infrared Heater Max: 9KW
Temperature Range RT~250℃
Top Air Heater Max:6KW
Temp. Control Accuracy ±15℃
Soldering Module
Min Diameter of Solder Nozzle ¢3/5
Wave Height 5mm
Solder Pot Capacity 8KG/pot
Soldering Temperature Max :350 ℃
Heating Time 40min/(300℃)
Pot Heating Power 1KW/Single pot
Location Speed X/Y:2-200mm/s  Z:2-50mm/s
Soldering Accuracy ±0.25mm
Control System
PC Operating System Windows10
Process Visualization CCD Visual
Software Language Chinese and English Changeable
Data Import Gerber、Image Import
Programming Mode Inline/Offline Programming
Electrical Parameter
Power Supply AC,380VAC 3Φ 5W 50/60Hz
Consumption 22KW
Air Exhaust
Air Duct Diameter ¢150mm
Exhaus Air Rate 360 M³/h
N2 Technology
Pressure 0.4-0.8 Mpa
N2 Consumption Each consumes about 1.5~2 M³/h
Concentration ≥99.999%
The above contents are subject to change without further notice!

MIS-300

Parameters MIS-300
Dimension(L×W×H) 800×1400×1400mm
Transporting System
PCB Width 60-300 mm
PCB Length 120-330 mm
PCB Top Side Clearance Max.120 mm
PCB Bottom Side Clearance Min.30 mm
PCB Edge Clearance 4 mm
Conveyor Height 900±20
Conveying speed 0.2-10M/min
Pallet/PCB weight Max: 5kg
Flux Module
Flux Capacity 2L
The Size of Flux Nozzle Tube 130um
Flux Width 2-8mm
Preheat Module
Bottom Dynamic Infrared Heater
Temperature Range
Top Air Heater
Temp. Control Accuracy
Soldering Module
Min Diameter of Solder Nozzle ¢3/5
Wave Height 5mm
Solder Pot Capacity 8KG/pot
Soldering Temperature Max :350 ℃
Heating Time 40min/(300℃)
Pot Heating Power 1KW/Single pot
Location Speed X/Y:2-200mm/s  Z:2-50mm/s
Soldering Accuracy ±0.25mm
Control System
PC Operating System Windows10
Process Visualization CCD Visual
Software Language Chinese and English Changeable
Data Import Gerber、Image Import
Programming Mode Inline/Offline Programming
Electrical Parameter
Power Supply AC,380V AC 3Φ 5W 50/60Hz
Consumption 4.5KW
Air Exhaust
Air Duct Diameter ¢150mm
Exhaus Air Rate 360 M³/h
N2 Technology
Pressure 0.4-0.8 Mpa
N2 Consumption Each consumes about 1.5~2 M³/h
Concentration ≥99.999%
The above contents are subject to change without further notice!

MIS-450

Parameters MIS-450
Dimension(L×W×H) 1000×1550×1400mm
Transporting System
PCB Width 60-450 mm
PCB Length 120-530 mm
PCB Top Side Clearance Max.120 mm
PCB Bottom Side Clearance Min.30 mm
PCB Edge Clearance 4 mm
Conveyor Height 900±20
Conveying speed 0.2-10M/min
Pallet/PCB weight Max:5kg
Flux Module
Flux Capacity 2L
The Size of Flux Nozzle Tube 130um(Double Nozzle is option)
Flux Width 2-8mm
Preheat Module
Bottom Dynamic Infrared Heater
Temperature Range
Top Air Heater
Temp. Control Accuracy
Soldering Module
Min Diameter of Solder Nozzle ¢3/5
Wave Height 5mm
Solder Pot Capacity 8KG/pot
Soldering Temperature Max :350 ℃
Heating Time 40min/(300℃)
Pot Heating Power 1KW/Single pot
Location Speed X/Y:2-200mm/s  Z:2-50mm/s
Soldering Accuracy ±0.25mm
Control System
PC Operating System Windows10
Process Visualization CCD Visual
Software Language Chinese and English Changeable
Data Import Gerber、Image Import
Programming Mode Inline/Offline Programming
Electrical Parameter
Power Supply AC,380VAC 3Φ 5W 50/60Hz
Consumption 4.5KW
Air Exhaust
Air Duct Diameter ¢150mm
Exhaus Air Rate 360 M³/h
N2 Technology
Pressure 0.4-0.8 Mpa
N2 Consumption Each consumes about 1.5~2 M³/h
Concentration ≥99.999%
The above contents are subject to change without further notice!

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Mini Selective Soldering System

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