Reflow Oven Machine

● Independent Air Velocity Controlling by section can achieve flexibleprocessing adjustment, therefore dealing with various & complicated Lead Free Processing easily;
● New Cooling Configuration to make the filteredor reclaimed air back to oven chamber, it reduced the thermal loss as well as get better flux reclamation;
● Longer maintenanceperiod for oven chamber;
●New Air Management System withsignificant energy save, lower electric power consumption & lower carbon;
● The chambers with multi-layers and thicker thermalinsulation to attain the lower temp. of oven surface.
● 95 % Materials of Reflow Oven can be recycled.

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A reflow oven machine is a vital device in SMT (Surface Mount Technology) manufacturing. It facilitates the soldering process of surface – mount components onto printed circuit boards (PCBs).
The operation typically involves multiple zones. In the preheating zone, the PCB is gradually warmed up to evaporate solvents in the solder paste and reduce thermal stress on components. Next is the soaking zone, where the temperature is maintained to ensure even heating. Then comes the reflow zone, with a high – temperature peak that melts the solder paste, enabling it to bond components to the PCB. Finally, in the cooling zone, the solder solidifies, creating reliable electrical and mechanical connections.
Advanced reflow ovens often feature precise temperature control, efficient heat – transfer mechanisms like hot – air convection, and user – friendly control systems for optimal soldering results.

MODEL RS-600III/RS-600III-N
GENERAL
Outside Dimension(L*W*H) 4190 x 1430 x 1530mm
Weight Approx. 1850KG/1950KG
Number Of Heating Zones Up 6 / Bottom 6
Length Of Heating Zones 2295mm
Number Of Cooling Zones Up 1 / Bottom 1  (Cool Air Conversion)
Exhaust Volume 10 m³ / min x 2 (Exhausts)
Control System
Electric Supply Required 3 phase, 380V 50/60Hz    (Optional: 3 phase, 400V/480V 50/60Hz )
Electric Power Required 48KW / 51KW
Power For Warm Up 24KW / 26KW
Power Consumption 6.5KW / 7KW
Warming Time Approx. 20 minute
Temp. Setting Range Room Temp. —  300℃
Temperature Control Method PID Close Loop Control + SSR Driving
Temperature Control Precision ± 1.0℃
Temperature Deviation on PCB ± 1.5℃  (by JT Board Test Standard)
Commutated Element Aluminium Alloy Plate
Data Storage Various prameters and status are storable (80GB)
Abnormal Alarm Abnormal Temperature (Extra-high / Extra-low Temp.)
Board Dropped Alarm Tower Light: Yellow–Warming; Green-Normal; Red-Abnormal
Conveyor System
Rail Structure Subsection Integrated Type     (Option : Subsection Separate Control)
Max.Width Of PCB 400mm (OPTION :460mm)
Range Of Rail Width/Adjustment 50~400mm / Motorized
Components Clearance PCB Top 30mm/ Bottom 25mm
Converyor Direction  L→R      (Option: R→L)
Fixed Rail Side Front Rail Fixed (Option:Rear Rail Fixed)
PCB Transmission Agent Air-Reflow =Chain + Mesh ,
( N2-Reflow = Chain only and Mesh optional)
Converyor Height 900±20mm
Converyor Speed Range 300~2000mm/min
Lubrication Auto-Afflux Standard
Cooling System
Cooling Method  Standard:Forced-Air Type

Notes: D:Dual rails,Fixed mode is optional,the max width of PCB is 250*250mm;N:Nitrogen;L:the max width of PCB is 610mm
The above contents are subiect to change without further notice.

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