An SMD reflow oven, also known as a surface mount device reflow oven, is a crucial piece of equipment in the electronics manufacturing industry. It plays a pivotal role in the Surface Mount Technology (SMT) process.
Equipped with multiple heating zones, it can precisely control the heating and cooling process. During operation, the printed circuit board (PCB) with surface – mount components attached is conveyed through these zones. In the pre – heat zone, the temperature gradually increases. This step eliminates moisture in the solder paste and ensures a stable start for the subsequent process, protecting components from thermal shock. Then comes the reflow zone, where the solder paste melts. This enables a firm connection between the components and the PCB. Finally, in the cooling zone, the board cools down, solidifying the solder joints.
Advanced SMD reflow ovens often feature intelligent control systems. These can accurately adjust temperature and conveyor speed according to different production requirements, guaranteeing high – quality soldering results.
| MODEL | RS-600III/RS-600III-N |
| GENERAL | |
| Outside Dimension(L*W*H) | 4190 x 1430 x 1530mm |
| Weight | Approx. 1850KG/1950KG |
| Number Of Heating Zones | Up 6 / Bottom 6 |
| Length Of Heating Zones | 2295mm |
| Number Of Cooling Zones | Up 1 / Bottom 1 (Cool Air Conversion) |
| Exhaust Volume | 10 m³ / min x 2 (Exhausts) |
| Control System | |
| Electric Supply Required | 3 phase, 380V 50/60Hz (Optional: 3 phase, 400V/480V 50/60Hz ) |
| Electric Power Required | 48KW / 51KW |
| Power For Warm Up | 24KW / 26KW |
| Power Consumption | 6.5KW / 7KW |
| Warming Time | Approx. 20 minute |
| Temp. Setting Range | Room Temp. — 300℃ |
| Temperature Control Method | PID Close Loop Control + SSR Driving |
| Temperature Control Precision | ± 1.0℃ |
| Temperature Deviation on PCB | ± 1.5℃ (by JT Board Test Standard) |
| Commutated Element | Aluminium Alloy Plate |
| Data Storage | Various prameters and status are storable (80GB) |
| Abnormal Alarm | Abnormal Temperature (Extra-high / Extra-low Temp.) |
| Board Dropped Alarm | Tower Light: Yellow–Warming; Green-Normal; Red-Abnormal |
| Conveyor System | |
| Rail Structure | Subsection Integrated Type (Option ： Subsection Separate Control) |
| Max.Width Of PCB | 400mm (OPTION ：460mm) |
| Range Of Rail Width/Adjustment | 50~400mm / Motorized |
| Components Clearance | PCB Top 30mm/ Bottom 25mm |
| Converyor Direction | L→R (Option: R→L) |
| Fixed Rail Side | Front Rail Fixed (Option:Rear Rail Fixed) |
| PCB Transmission Agent | Air-Reflow =Chain + Mesh , ( N2-Reflow = Chain only and Mesh optional) |
| Converyor Height | 900±20mm |
| Converyor Speed Range | 300～2000mm/min |
| Lubrication Auto-Afflux | Standard |
| Cooling System | |
| Cooling Method | Standard：Forced-Air Type |
Notes: D：Dual rails，Fixed mode is optional,the max width of PCB is 250*250mm；N：Nitrogen；L：the max width of PCB is 610mm
The above contents are subiect to change without further notice.
