Smd Soldering Oven

● Independent Air Velocity Controlling by section can achieve flexibleprocessing adjustment, therefore dealing with various & complicated Lead Free Processing easily;
● New Cooling Configuration to make the filteredor reclaimed air back to oven chamber, it reduced the thermal loss as well as get better flux reclamation;
● Longer maintenanceperiod for oven chamber;
●New Air Management System withsignificant energy save, lower electric power consumption & lower carbon;
● The chambers with multi-layers and thicker thermalinsulation to attain the lower temp. of oven surface.
● 95 % Materials of Reflow Oven can be recycled.

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An SMD soldering oven, also known as a reflow oven, is crucial in electronic manufacturing for soldering surface – mount devices (SMDs) onto printed circuit boards (PCBs). It usually has multiple heating zones like preheating, constant temperature, reflow, and cooling. The preheating zone activates the solder paste, while the constant – temperature zone balances component temperatures. The reflow zone melts the solder paste to bond SMDs to PCBs, and the cooling zone solidifies the solder joints. With features such as accurate temperature control, stable conveyor systems, and often an intelligent control panel, it ensures high – quality soldering results for various electronic products.

MODEL RS-600III/RS-600III-N
GENERAL
Outside Dimension(L*W*H) 4190 x 1430 x 1530mm
Weight Approx. 1850KG/1950KG
Number Of Heating Zones Up 6 / Bottom 6
Length Of Heating Zones 2295mm
Number Of Cooling Zones Up 1 / Bottom 1  (Cool Air Conversion)
Exhaust Volume 10 m³ / min x 2 (Exhausts)
Control System
Electric Supply Required 3 phase, 380V 50/60Hz    (Optional: 3 phase, 400V/480V 50/60Hz )
Electric Power Required 48KW / 51KW
Power For Warm Up 24KW / 26KW
Power Consumption 6.5KW / 7KW
Warming Time Approx. 20 minute
Temp. Setting Range Room Temp. —  300℃
Temperature Control Method PID Close Loop Control + SSR Driving
Temperature Control Precision ± 1.0℃
Temperature Deviation on PCB ± 1.5℃  (by JT Board Test Standard)
Commutated Element Aluminium Alloy Plate
Data Storage Various prameters and status are storable (80GB)
Abnormal Alarm Abnormal Temperature (Extra-high / Extra-low Temp.)
Board Dropped Alarm Tower Light: Yellow–Warming; Green-Normal; Red-Abnormal
Conveyor System
Rail Structure Subsection Integrated Type     (Option : Subsection Separate Control)
Max.Width Of PCB 400mm (OPTION :460mm)
Range Of Rail Width/Adjustment 50~400mm / Motorized
Components Clearance PCB Top 30mm/ Bottom 25mm
Converyor Direction  L→R      (Option: R→L)
Fixed Rail Side Front Rail Fixed (Option:Rear Rail Fixed)
PCB Transmission Agent Air-Reflow =Chain + Mesh ,
( N2-Reflow = Chain only and Mesh optional)
Converyor Height 900±20mm
Converyor Speed Range 300~2000mm/min
Lubrication Auto-Afflux Standard
Cooling System
Cooling Method  Standard:Forced-Air Type

Notes: D:Dual rails,Fixed mode is optional,the max width of PCB is 250*250mm;N:Nitrogen;L:the max width of PCB is 610mm
The above contents are subiect to change without further notice.

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