Smt Spi Machine

● 3D solder paste inspection based on white-lightsine stripe PMP technology;
● Solder paste height inspection accuracy reaches 1 um;
● Auto-restore pad 3D data on PCB surface, calculate thevolume, area, height and deviation of every solder
● Multi-direction,multi-angle 3D PMP inspection;
● Vivid and easy to used graphic interaction interface, comprehensive function and easy to handle;
● In addition to programming with Gerber file, image-oriented edit mode can also realize off-lineprogramming and debugging;
● Multi-touch function can realize 3D image rotationand 2D image resizing, convenient to check and confirm solder paste condition;
● Comprehensives SPC function includes manykind of diagrams generation and output;
● Image accelerate calculations base on multi-GPU;
● Integrated cast iron frame structure, highrigidity can avoid outside vibration

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An SMT SPI (Solder Paste Inspection) machine is a critical quality control system in surface mount technology (SMT) production lines. Installed directly after the stencil printer, this automated optical inspection (AOI) equipment performs high-speed 3D measurement of solder paste deposits with micron-level precision (typically 5-10μm resolution).

Key capabilities include:
• Accurate volume/height/area measurement (±3% tolerance)
• Bridging and insufficient paste detection
• Real-time process feedback to printers
• 15-30 second inspection cycle per PCB

Modern SPI machines feature:
• Multi-spectral imaging technology
• AI-based defect classification
• Industry 4.0 connectivity (MES/SPC integration)
• Support for 01005 components and 0.3mm pitch BGAs

By catching 95%+ of paste defects pre-reflow, SPI machines significantly reduce rework costs and improve first-pass yields in high-reliability electronics manufacturing.

Model REFINE-XS
Inspection Module
Camera Specification 5M High-frequency Industrial Camera, High Frame Number (Factory Setting); 12M Option
Pixel 20μm, 15μmꢀ(Factory Setting)
FOV(single field of view) Range 40×40 mm, 30×30 mm (Factory Setting)
LED RGB + TOP
Light Source 0 – 550 μm
Height Inspection Resolution 0.36 μm
Height Inspection Accuracy 1μm (Based on the actual solder paste/calibration block)
Inspection Item Volume, Area, Height, X/Y Position, Bridging, Shape, etc
Defective Type Excessive/Insufficient/Missing paste,Bridge,2D & 3D Paste displacement, Shape deformity, Dust, etc
Repeatability (Volume, Area, Height) <1% @3sigma
GR & R (Gauge Reproducebility and Repeatability) < 10% (@6sigma tolerance = +/- 50%)
Inspection Speed 0.35Sec / FOV
Conveyor & PCB Size
Max PCB Size 460×410 mm
Min PCB Size 50×50 mm
PCB Up-Clearance 30 mm
PCB Bottom-Clearance 30 mm
PCB Thickness 0.5-5 mm
Max PCB Warpage ±3 mm
PCB Transfer Height 2.5mm
PCB Transfer Height 900±20 mm
Max PCB Weight 5KG
Frame & Others
Base & Frame Integra1 steel casmting frame; firmly, ensure high accuracy of inspection
Dimensions and Weight 947x1321x1600mm (W x D x H) 950KG
Power Supply AC 220V 1Φ 50/60Hz
Power 2.2KW
Communication Interface SMEMA
Air Supply 4-6bar,5L/min
Operating Condition 5-40℃, 15-90% RH
Options
1. BarcodeReader 4. Repair Station (PC)
2. 3D Calibration Target 5. Infared Muti-touch LCD + Voice Control
3. 2D Calibration Glass 6. Offline Editing Software (License Key)
The above contents are subject to change without further notice!

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