Spi Inspection

● 3D solder paste inspection based on white-lightsine stripe PMP technology;
● Solder paste height inspection accuracy reaches 1 um;
● Auto-restore pad 3D data on PCB surface, calculate thevolume, area, height and deviation of every solder
● Multi-direction,multi-angle 3D PMP inspection;
● Vivid and easy to used graphic interaction interface, comprehensive function and easy to handle;
● In addition to programming with Gerber file, image-oriented edit mode can also realize off-lineprogramming and debugging;
● Multi-touch function can realize 3D image rotationand 2D image resizing, convenient to check and confirm solder paste condition;
● Comprehensives SPC function includes manykind of diagrams generation and output;
● Image accelerate calculations base on multi-GPU;
● Integrated cast iron frame structure, highrigidity can avoid outside vibration

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SPI is a critical quality control step in the SMT manufacturing process. It uses advanced imaging or laser technology to inspect solder paste applied to PCB pads. Inspectors verify the amount, placement, and uniformity of the solder paste, and detect defects such as insufficient solder paste, misalignment, or bridging. By detecting problems early, SPI inspection can prevent soldering failures, ensure reliable component bonding, and improve the overall production quality of electronic assemblies.

Model REFINE-XS
Inspection Module
Camera Specification 5M High-frequency Industrial Camera, High Frame Number (Factory Setting); 12M Option
Pixel 20μm, 15μmꢀ(Factory Setting)
FOV(single field of view) Range 40×40 mm, 30×30 mm (Factory Setting)
LED RGB + TOP
Light Source 0 – 550 μm
Height Inspection Resolution 0.36 μm
Height Inspection Accuracy 1μm (Based on the actual solder paste/calibration block)
Inspection Item Volume, Area, Height, X/Y Position, Bridging, Shape, etc
Defective Type Excessive/Insufficient/Missing paste,Bridge,2D & 3D Paste displacement, Shape deformity, Dust, etc
Repeatability (Volume, Area, Height) <1% @3sigma
GR & R (Gauge Reproducebility and Repeatability) < 10% (@6sigma tolerance = +/- 50%)
Inspection Speed 0.35Sec / FOV
Conveyor & PCB Size
Max PCB Size 460×410 mm
Min PCB Size 50×50 mm
PCB Up-Clearance 30 mm
PCB Bottom-Clearance 30 mm
PCB Thickness 0.5-5 mm
Max PCB Warpage ±3 mm
PCB Transfer Height 2.5mm
PCB Transfer Height 900±20 mm
Max PCB Weight 5KG
Frame & Others
Base & Frame Integra1 steel casmting frame; firmly, ensure high accuracy of inspection
Dimensions and Weight 947x1321x1600mm (W x D x H) 950KG
Power Supply AC 220V 1Φ 50/60Hz
Power 2.2KW
Communication Interface SMEMA
Air Supply 4-6bar,5L/min
Operating Condition 5-40℃, 15-90% RH
Options
1. BarcodeReader 4. Repair Station (PC)
2. 3D Calibration Target 5. Infared Muti-touch LCD + Voice Control
3. 2D Calibration Glass 6. Offline Editing Software (License Key)
The above contents are subject to change without further notice!

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