What you need to know about vacuum reflow ovens

Vacuum reflow oven equipment structure

according to the set of cycle times, the PCB board enters from the entrance of the equipment, through the preheating area, constant temperature area, and soldering area, then into the vacuum chamber, when the chamber transportation stops, the upper cap drop seal starts to extract the vacuum, reaches the set pressure (10 mbar-5 mbar) time vacuum chamber, releases the upper chamber, opens the pressure, vacuum transmission cycle time out and enters the cooling area, cycle time of vacuum soldering is completed.

Vacuum reflow oven working process curve

Precise pressure and reflow temperature profile:

As the same as standard reflow soldering, each heating area has heat insulation, and the temperature of each heating area can be adjusted separately to ensure a flexible temperature curve and soldering process. When the vacuum process can still reach the set reflow temperature profile below 10 mbar; the vacuum chamber inside the auxiliary heating function can reach the conventional standard setting to ensure the realization of the efficient temperature production process.

Types and characteristics of vacuum reflow ovens

At Shenzhen JT Automation Equipment Co., Ltd, we mainly provide TRS series semiconductor packaging reflow ovens and TRV series vacuum-assisted reflow ovens.

TRS Series Semiconductor Package Reflow Oven

TRS series semiconductor package reflow oven, in its performance and technical parameters are more than the traditional welding equipment The main features are: high precision temperature control, high stability chip transfer system, ultra-low oxygen content control, and The main features are: high precision temperature control, high stability chip transfer system, ultra-low oxygen content control, and the mechanism design to meet the thousand-grade dust-free soldering environment, etc., which can upgrade the industry for customers and gain greater benefits.

TRV Series Vacuum Assisted Reflow Soldering

JT in-line vacuum reflow soldering can realize automatic mass production of vacuum soldering and reduce production costs; built-in vacuum module, vacuum can be extracted in sections, and the best cavity rate can be reduced to less than 1%; it can be directly shifted to the ordinary reflow temperature profile, which is convenient and adjustable.

What are the gains of a vacuum reflow oven?

Vacuum reflow ovens are the result of advanced manufacturing development in the technology world. It comes in the most sophisticated and luxurious designs with the following capabilities:

Low void rates

Utilizing a vacuum cycle during the reflow process, vacuum reflow ovens can remove voids and bubbles in solder joints and interfaces. Voids area can reach <1% by the vacuum pressure 10-5 mbar.

Highest UPH

The vacuum reflow ovens give the luxury of an optional staging conveyor for the fastest and highest vacuum chamber transfer times.

High-temperature profile

Vacuum reflow ovens come with reflow temperature profiles. It prevents defects in final products. It measures multiple points on PCBs to determine an accurate temperature range. It works like a direct graph of temperature and time.

Conclusion 

Shenzhen JT Automation Equipment Co., Ltd. Without a doubt, it is the most professional OEM. The prime focus of the company is customer ease. The machine's advanced features make it highly efficient and reliable and guarantee its quality.